Disclosed is a semiconductor package capable of improving a thermal emission property. The semiconductor package includes a substrate having a window, a first wiring, and a second wiring. A semiconductor chip is attached to the substrate. A metal pattern is formed at a pad-forming surface of the semiconductor chip. A first metal wire connects the bonding pad to a first bond finger and a second metal wire connects the metal pattern to a second bond finger. A sealing member is provided to seal the substrate. A first solder ball is attached to a first ball land and a second solder ball is attached to the second ball land.