A mounting head unit for an electronic component for making a pick-up operation of the electronic component and loading operation thereof is removably attached to a head mounting bracket of an electronic component mounting device. Each mounting head unit is provided with a control board for controlling the a mounting mechanism including a plurality of unit mounting heads each equipped with an adsorption nozzle for holding the electronic component. In the mounting operation, on the basis of the operation command from a main unit control section for controlling the entire operation of the electronic component mounting device, the control board controls the operation of each of the unit mounting heads. In this way, the replacement of wirings in replacing the mounting head can be easily made and the time delay in signal processing can be removed to realize the high speed operation.