An object to provide a hot plate making it possible to heat an object to be heated uniformly, and the hot plate of the present invention is characterized in that a resistance element having a thickness dispersion of 3 m or less is formed on an insulating substrate.

 
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> Wafer with semiconductor chips mounted thereon

> Semiconductor device manufacturing method having a step of applying a copper foil on a substrate as a part of a wiring connecting an electrode pad to a mounting terminal
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