It is, therefore, an object of the present invention to provide a structure and method for an integrated circuit comprising a first gate, a second gate, and source and drain regions adjacent the first and second gates, wherein the structure has a planar upper structure and the first gate, source and drain regions are silicided in a single self-aligned process (salicide).

 
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< Divot reduction in SIMOX layers

> Transistor with nitrogen-hardened gate oxide

> Structure and method for ultra-small grain size polysilicon

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