The present invention relates to an integrated circuit system with at least one integrated circuit, a cooling body to dissipate the heat generated by the integrated circuit and a latent heat storage module having a latent heat storage medium. The latent heat storage module is thermally connected to the cooling body in order to temporarily store the heat generated by the integrated circuit and to convey it to the cooling body. The integrated circuit has at least one semiconductor component which is assembled on a substrate and the substrate is in direct thermal contact with the latent heat storage module.

 
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< Vehicle heating and air conditioning modules

< Mode switching control device of vehicle air-conditioning apparatus

> Device to convey the cool air from an air-conditioner into a computer

> Controlling thermal, acoustic, and/or electromagnetic properties of a computing device

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