An object of the present invention is to provide an apparatus for manufacturing a stacked type electronic part which can manufacture a stacked type electronic part dried at low temperature for a product by increasing a manufacturing speed. A base plate is placed in a predetermined linear section path to be moved back and forth and be moved vertically. Above the section path are juxtaposed one or more insulator layer forming means discharging an insulating resin paste, conductor layer forming means jetting a conductor paste by an ink jet system and drying means drying the pastes. A thin film layer having a predetermined conductor pattern placed on an insulator layer while the base plate is moved back and forth one or more times. Those steps are repeated to form a stacked type electronic part.