A composite integrated circuit is formed by being molded with a mold resin, including a seat member of a lead frame, a substrate attached on the seat member of the lead frame, a heater element, and a temperature-restricted element. Here, the heater element and the temperature-restricted element are mounted on the substrate. The seat member of the lead frame includes a hollow member that is located under an intermediate area between the heater element and the temperature-restricted element.

 
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> Adjusting device for a stator for an optical disk drive motor

> Triazaspiro[5.5]undecane derivatives and pharmaceutical compositions comprising thereof, as an active ingredient
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