A method of manufacturing a plurality of semiconductor chip packages and the
resulting
chip package assemblies. The method includes providing a circuitized substrate
having terminals and leads. A first microelectronic element is arranged with the
substrate and contacts on the microelectronic element are connected to the substrate.
A conductive member is placed on top of the first microelectronic element and is
used to support a second microelectronic element. The second microelectronic element
is arranged with the conductive member in a top and bottom position. The second
microelectronic element is then also connected by leads from contacts on the second
microelectronic element to pads and terminals on the circuitized substrate. The
conductive member is then connected to a third pad or set of pads on the substrate.
An encapsulant material may be deposited so as to encapsulate the leads and at
least one surface of the microelectronic elements. The encapsulant material is
then cured thereby defining a composite of chip assemblies which may be singulated
into individual chip packages.