A solvent-free thermosetting resin composition which comprises an epoxy resin
(a)
and a product (b) of the reaction of an organosilicon compound, represented by
the general formula (1) (where R is an organic group containing a functional group
reactive with an epoxy resin by addition reaction; and R1 is a methyl or ethyl
group), with water, the product (b) containing organosilicon compound polycondensates
formed in the epoxy resin (a) and having a degree of polycondensation of 2 or higher,
and which has a low viscosity at a room temperature (25 C.) and gives a cured
resin having intact material properties, especially intact high-temperature mechanical
properties; a process for producing the resin composition; and a product obtained
by applying the composition.
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