CMP formulations for use on nickel/phosphorus alloys comprising abrasive particles and an oxidant, a modifier for the action of the oxidant and first and second accelerants to sequester removed materials containing phosphonate and ammonium or amine groups respectively and optionally an organic carboxylic acid.

 
Web www.patentalert.com

< Chemical control over ceramic porosity using carboxylate-alumoxanes

< Transparent electrode, optoelectronic apparatus and devices

> Multilayer polymer gradient index (GRIN) lenses

> Fiber incorporating quantum dots as programmable dopants

~ 00209