An integrated circuit includes an electric resistor trace, a substrate and a thermally conductive structure arranged above or below the electric resistor trace for dissipating heat from the electric resistor trace to the substrate. The present invention is based on the finding that by introducing the additional thermally conductive structure, despite the introduction of this additional thermally conductive structure requiring space at first, due to the significantly increased heat conductivity to the substrate, a smaller overall chip area for implementing integrated resistors can be obtained.