A wire loop comprises a wire connecting a first bonding point and a second bonding
point therethrough, wherein the wire has a crushed part formed therein by crushing
the part of the wire and a top of a ball bonded to the first bonding point with
a capillary. The wire loop is formed by a wire bonding method which includes: bonding
the wire to the first bonding point; moving the capillary horizontally and vertically
while carrying out loop control; bonding the wire to the vicinity of the top of
the ball bonded to the first bonding point; and thereafter, moving the capillary
horizontally and vertically to the second bonding point while delivering the wire
and carrying out loop control, and then bonding the wire to the second bonding point.