The invention is a semiconductor device and a method of forming the semiconductor device. The semiconductor device comprises a substrate; buried bitlines formed in the substrate narrower than achievable at a resolution limit of lithography; a doped region formed adjacent at least one of the buried bitlines; a charge trapping layer disposed over the substrate; and a conductive layer disposed over the charge trapping layer, wherein the doped region adjacent the least one of the buried bitlines inhibits a leakage current between the buried bitlines.

 
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