Disclosed is an assembly system for stationing a semiconductor wafer suitable
for processing said wafer, said system comprising: (a) a holding block; (b) a semiconductor
wafer; and (c) an aqueous adhesive composition interposed between the holding block
and the semiconductor wafer. Also disclosed is a process for manufacturing a semiconductor
wafer, comprising the steps of: (a) providing a holding block; (b) providing a
semiconductor wafer; (c) coating either the holding block or one side of the semiconductor
wafer with the foregoing aqueous adhesive composition; (d) contacting either one
side of the semiconductor wafer to the coated holding block or the coated side
of the semiconductor wafer to the holding block, such that the semiconductor wafer
adheres to the coated holding block; (e) polishing the other side of the semiconductor
wafer; and (f) removing the semiconductor wafer from the coated holding block.
