This specification describes techniques for manufacturing an electronic system
module. The module includes flexible multi-layer interconnection circuits with
trace widths of 5 microns or less. A glass panel manufacturing facility, similar
to those employed for making liquid crystal display, LCD, panels is used to fabricate
the interconnection circuits. A polymer base layer is formed on a glass carrier
with an intermediate release layer. Alternate layers of metal and dielectric are
formed on the base layer, and patterned to create an array of multi-layer interconnection
circuits on the glass panel. A thick layer of polymer is deposited on the interconnection
circuit, and openings formed at input/output (I/O) pad locations. Solder paste
is deposited in the openings to form wells filled with solder. After dicing the
glass carrier to form separated interconnection circuits, IC chips are stud bumped
and assembled using flip chip bonding, wherein the stud bumps on the components
are inserted into corresponding wells on the interconnection circuits. The IC chips
are tested and reworked to form tested circuit assemblies. Methods for connecting
to testers and to other modules and electronic systems are described. Module packaging
layers are provided for hermetic sealing and for electromagnetic shielding. A blade
server embodiment is also described.
