An electroless deposition system is provided. The system includes a
processing mainframe, at least one substrate cleaning station positioned
on the mainframe, and an electroless deposition station positioned on the
mainframe. The electroless deposition station includes an environmentally
controlled processing enclosure, a first processing station configured to
clean and activate a surface of a substrate, a second processing station
configured to electrolessly deposit a layer onto the surface of the
substrate, and a substrate transfer shuttle positioned to transfer
substrates between the first and second processing stations. The system
also includes a substrate transfer robot positioned on the mainframe and
configured to access an interior of the processing enclosure.
