An optical assembly comprising an optical cube. A first optical transmitter chip
and a first optical receiver chip are mounted on one surface of the optical cube.
A first continuous printed circuit board is soldered to electrical surfaces of
the first optical transmitter chip and the first optical receiver chip opposite
the optical cube. A second optical transmitter chip and a second optical receiver
chip are mounted on an opposite surface of the optical cube. A second continuous
printed circuit board is soldered to electrical surfaces of the second optical
transmitter chip and the second optical receiver chip opposite the optical cube.
The first optical transmitter chip is optically aligned with the second optical
receiver chip through the optical cube. The second optical transmitter chip is
optically aligned with the first optical receiver chip through the optical cube.
The first and second printed circuit boards may be bent ninety degrees and soldered
to another printed circuit board, or connected to an edge connector on another
printed circuit board.
