An etch processor for etching a wafer includes a chuck for holding the wafer
and
a temperature sensor reporting a temperature of the wafer. The chuck includes a
heater controlled by a temperature control system. The temperature sensor is operatively
coupled to the temperature control system to maintain the temperature of the chuck
at a selectable setpoint temperature. A first setpoint temperature and a second
setpoint temperature are selected. The wafer is placed on the chuck and set to
the first setpoint temperature. The wafer is then processed for a first period
of time at the first setpoint temperature and for a second period of time at the
second setpoint temperature.
