In accordance with the present invention, there are provided novel thermosetting
resin compositions which do not require solvent to provide a system having suitable
viscosity for convenient handling. Invention compositions have the benefit of undergoing
rapid cure. The resulting thermosets are stable to elevated temperatures, are highly
flexible, have low moisture uptake and are consequently useful in a variety of
applications, e.g., in adhesive applications since they display good adhesion to
both the substrate and the device attached thereto.
