A thermosetting resin composition which contains:
- (A) an epoxy resin having at least two epoxy groups per molecule;
- (B) a hardener;
- (C) a compound represented by the following general formula (1) or (2); and
- (D) a microcapsule type hardening accelerator containing microcapsules
each having a structure made up of a core containing a hardening accelerator and
a shell covering the core and containing a polymer having a structural unit represented
by the following general formula (3), and which, when examined by differential
scanning calorimetry at a heating rate of 10 C./min, shows an exothermic
peak due to reaction in the range of from 180 to 250 C., and
- a semiconductor device obtained through sealing with the composition
are described.
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