A semiconductor device which is sealed with a plastic sealing layer and whose
thickness
is regulated to be below a given value is known. Since the thickness of the device
is small, and the thickness of the upper portion of the plastic sealing layer and
the thickness of the lower portion thereof are different from each other, the plastic
sealing layer becomes warped, thus causing a crack on the side of the semiconductor chip.
To solve this problem, the semiconductor device according to the present invention
comprises a semiconductor chip on which a plurality of grooves are defined. Consequently,
the thickness of the lower portion of the plastic layer becomes greater, thereby
preventing cracks from occurring on the semiconductor chip.
