In order to improve the heat-conducting connection between a contact element
(3)
and a ceiling panel (1) which are adhesively bonded to one another, the
contact panel (5) of the contact element (3) is provided with an
adhesive depression (10) in the contact surface (6), said depression
taking up only part of said contact surface, while the remaining part of the latter
rests directly against the upper side of the ceiling panel (1). The contact
panel (5) may be elastically or plastically deformable, e.g. along a bending
groove (9), with the result that it adapts more easily to irregularities,
such as those caused, for example, by slight sagging of the ceiling panel (1).
This permits larger widths of the contact panel (5) without impairing the
thermal contact. In order to ensure close abutment of the parts of the contact
surface (6) which are not adhesively bonded to the upper side of the ceiling
panel (1), the contact panel (5) can be appropriately prestressed.
