The present invention relates to a method of packaging optical parts for optical
communication. According to the method of the present invention, there are advantages
in that a packaging process for optical parts is automated to improve productivity
and to obtain price competitiveness and uniformity of quality, and a high frequency
heater for locally transferring heat to only a solder preform is used to minimize
thermal deformation of areas except a soldering area, thereby achieving highly
reliable packaging of the optical parts.
