The present invention provides in-line equipment and methods for manufacturing
an EMI/RFI shield that is integrated formed in a formable sheet. The EMI/RFI shield
may comprise a shaped thermoform shell that has one or more conductive layers applied
to one or more surfaces. The EMI/RFI shield may be integrally formed with the formable
sheet via attachment tabs that are positioned along one or more edges of the EMI/RFI shield.
