A sensor package is disclosed. The sensor package includes a housing that has
a
recess and a sealing member epoxied within the recess of the housing. The housing
also has small EDM holes to allow conductive output wires to feed through the housing.
The sealing member provides a seal for the holes of the conductive outputs of the
sensor package. The sensor package further includes a sensing die, which detects
a pressure, and outputs an electrical signal through the output wires.
