A probe card apparatus comprising a rigid substrate having thermal expansion
characteristics
near that of silicon, laminated with a flex film having laser patterned leads and
contact pads, and contact elements comprising noble metals protruding from two
major surfaces, the first mirroring the closely spaced chip pads, and the second
aligned to the more generously spaced probe card pads, providing an accurate and
reproducible, low cost, rapidly fabricated probe contact device, capable of contacting
very high density bond pads in either area array or perimeter locations, of being
electrically optimized, and readily maintained.
