A hybrid integration process for fabrication of an optical cross-connect switching
apparatus. The switching element is based on the deflection of light beam in electro-optic
materials by applying electric field across electrodes of an appropriate configuration.
The integration process includes fabrication of a substrate (e.g. silicon substrate)
with 2D imaging optics from polymeric materials (or silica), fabrication of the
light deflecting element, and assembly of the deflecting element on the substrate
with imaging optics. The fabrication of the light deflecting element includes fabrication
of a LN (lithium niobate) block. The LN block assembled in an optical switching
apparatus includes a two-dimensional waveguide formed on a surface of the LN block
and an electrode on a surface of the LN block.
