A heat transfer structure includes a heat transfer module having a plurality
of
heat transfer members in the duct chamber with the density increased in the direction
of the flow of the coolant and having a greatest density adjacent to the position
of a heat source attached in thermal contact with the heat transfer module. The
profile of the duct chamber is adjusted to the position of the heat source to increase
the velocity of coolant directly under the heat source and to partially or completely
block the coolant flow to the areas which do not need to be temperature adjusted.
The heat transfer members may be formed as pin fins fabricated from springs compressed
to a predetermined density in a direction perpendicular to the longitudinal axis
of the spring (and/or in parallel to the longitudinal axis of the heat transfer module).
