An apparatus and method for automatically detecting defects on silicon dies on
silicon wafers comprising a silicon wafer acquisition system (30) and a
computer (32) connected to said silicon wafer image acquisition system (10),
wherein said computer (32) automatically aligns a silicon wafer (16),
calibrates the image acquisition system (30), analyzes die images by determining
a statistical die model from a plurality of dies, and compares the statistical
die model to silicon die images to determine if the silicon dies have surface defects,
is disclosed.
