The invention provides a structural principle wherein a combination fan-heatsink
type cooling device transfers a large amount of heat into an ambient while producing
minimal acoustic noise. The fan-heatsink has top and bottom cover members with
a central power shaft between them, the shaft has fins that rotate around the shaft
between the covers to move ambient. The ambient enters the fan-heatsink through
inlets through the covers near the central power shaft and is forced out through
louvers that make up the peripheral of the fan-heatsink housing. The fan-heatsink
cooling device is positioned so that heat radiating from the heat source such as
a chip enters the housing through the inlets near the central shaft and heat pipes
are arranged to carry heat from the chip source to and through the louvers so that
the ambient forced through the louvers absorbs heat transferred to the louvers
at the place where it is immediately carried out of the fan-heatsink structure.
