The stripping agent is sprayed from the tip of the nozzle 33 onto the
wafer surface, while the first supply nozzle 33 is actuated to scan from
the central portion of the wafer to the outer portion thereof. This operation provides
the situation, in which the interface of the residual droplet 38 is pulled
back from the center of the wafer to the outer portion of the wafer by the surface
tension of the stripping agent supplied from the nozzle. Meanwhile, the second
supply nozzle 36 also scans at a same scanning speed as the first supply
nozzle 33 scans. Vapor IPA is sprayed from the orifice of the second supply
nozzle 36. This provides that vapor IPA is sprayed onto the wafer surface
immediately after the stripping agent is sprayed thereon from the first supply
nozzle 33, and the residual stripping agent on the wafer surface is efficiently
replaced with IPA.
