A mixture of a self-curing epoxy resin having an equivalent weight of from about
100 to about 700, a melt viscosity of from about 200 to about 2000 centipoise at
150 C. and a low temperature curing agent capable of maintaining its own
domain during extrusion which is extruded as one component at a temperature below
220 F. and the extrudate is cooled and pulverized to form a low temperature
curable coating powder. The powder cures at a temperature of from about 225 to
about 300 F. and produces a coating having an exceptionally smooth surface
with either a low or high gloss. The powder is particularly useful for coating
heat sensitive substrates such as plastics, paper, cardboard and wood.
