A test probe for semiconductor devices, the test probe having a tip portion which
is pressed against a test pad of a semiconductor device to establish electrical
contact between the tip portion and the pad for testing the operation of the semiconductor
device, wherein the probe is formed to have a tip shape with an angle of not less
than 15 degrees formed at the surface of the pad between a tangential line with
respect to a tip face of the probe and the pad surface when the probe is pressed
against the pad, the tip shape of the probe having a spherical surface meeting
the relationship of:
where the radius of curvature of the spherical surface is R, the thickness
of the pad is t, and the angle formed at the pad surface between the tangential
line with respect to the probe tip face and the pad surface when the probe is pressed
against the pad is , the probe have a flat portion at an end of the tip
portion. Accordingly, a contact surface can be established between the probe trip
and the pad with a sufficient degree of electrical continuity, and when the the
probe level is adjusted in the probing, a time required for positioning the probe
prior to the start of measurement is cut down and variation in measurement are reduced.
