An active matrix substrate comprises a substrate, a thick-film adhesive pad made
of organic resin, provided on the substrate and including, at least at a part of
a side face thereof, an inclined region having a first contact angle smaller than
90 degrees to the main face of the substrate, a thin-film active element provided
on the thick-film adhesive pad, and a thin-film interconnection line connected
to the thin-film active element and extending onto the substrate via the inclined
region, a film thickness of the thick-film adhesive pad being four or more times
that of the thin-film interconnection line.
