Lead-free solder alloy and lead-free solder paste using the same

   
   

Disclosed is a lead-free solder alloy containing 43 to 47% by weight of bismuth, 0.5 to 2.5% by weight of silver, 0.25 to 0.75% by weight of copper, 0.25 to 0.75% by weight of indium, 0.02 to 0.09% by weight of nickel and the balance of tin.

Révélé est un alliage sans plomb de soudure contenant 43 à 47% du poids du bismuth, 0.5 à 2.5% du poids de l'argent, 0.25 à 0.75% du poids du cuivre, 0.25 à 0.75% du poids de l'indium, 0.02 à 0.09% du poids du nickel et l'équilibre de l'étain.

 
Web www.patentalert.com

< Device for releasably attaching and storing a focusing straw onto an aerosol can

< Delivery of diphenhydramine through an inhalation route

> Systems and methods for compression of key sets having multiple keys

> Method and apparatus for routing sets of nets

~ 00175