Polishing member and method of manufacturing semiconductor device

   
   

There is provide a polishing member including photocatalyst particles that exhibit photocatalysis on light irradiation, and a support material that supports the photocatalyst particles. There is also provided a method of manufacturing a semiconductor device, including polishing a surface of a workpiece that is to be used as at least a portion of the semiconductor device with the polishing member with a fluid interposed between the polishing member and the surface of the workpiece while performing light irradiation onto the polishing member.

Обеспечивают полируя член включая частицы photocatalyst exhibit photocatalysis на светлом облучении, и материал поддержки который поддерживает частицы photocatalyst. Также обеспечено методу изготовлять прибора на полупроводниках, включая полировать поверхность workpiece который должен быть использованным как по крайней мере часть прибора на полупроводниках с полируя членом при жидкость interposed между полируя членом и поверхностью workpiece пока выполняющ светлое облучение на полируя член.

 
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