A communication apparatus including a radio frequency (RF) circuit module
can be reduced in the number of components therefor to reduce the cost for
its components and to simplify its fabrication process and thus reduce the
cost for manufacturing the same while the RF circuit module can also be
shielded reliably. The RF circuit module includes a printed circuit board
having an upper surface with a circuit component mounted thereto and a
lower surface provided with a shielding conductor of metal. The printed
circuit board is fit into a shielding frame to assemble the RF circuit
module. The RF circuit module is then turned over and thus mounted on that
upper surface of a mother board which is provided with conductors of
metal. Such conductors of metal and the frame can shield the RF circuit
module.
