Bath and method of electroless plating of silver on metal surfaces

   
   

Known methods of improving the solderability of copper surfaces on printed circuit boards present the disadvantage that outer layers of an irregular thickness are formed at the metal surfaces, that these layers are very expensive or that the constituents used in manufacturing them are harmful to the environment. Furthermore, the metal surfaces are to be suited to form bond connections as well as electrical contacts. To overcome these problems there are disclosed a bath and a method of electroless plating of silver by way of charge exchange reaction on surfaces of metals that are less noble than silver, more particularly on copper, that contain at least one silver halide complex and not containing any reducing agent for Ag.sup.+ ions.

Os métodos sabidos de melhorar o solderability das superfícies de cobre em placas de circuito impressas apresentam a desvantagem que as camadas exteriores de uma espessura irregular estão dadas forma nas superfícies do metal, que estas camadas são muito caras ou que os constituents usados no manufacturing elas são prejudiciais ao ambiente. Além disso, as superfícies do metal devem ser servidas para dar forma a conexões bond as.well.as contatos elétricos. Para superar estes problemas lá são divulgados um banho e um método do chapeamento electroless da prata por a reação da troca da carga em superfícies dos metais que são mais menos nobres do que a prata, mais particularmente no cobre, que contem ao menos um complexo do halide de prata e não conter nenhum agente se reduzindo para íons de Ag.sup.+.

 
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