The present invention discloses a white gold composition consisting
essentially of copper, silver, zinc, and manganese, and further consisting
of small amounts of tin, cobalt, silicon/copper and boron/copper. More
particularly, the white gold composition of the present invention
discloses a white gold composition consisting essentially of about 36% to
about 57% copper, about 10% silver, about 18.2% to about 24.2% zinc, about
14% to about 28.9% manganese, and the balance further consisting of about
1% tin, about 0.025% to about 0.03% cobalt, about 0.52% silicon/copper,
and about 0.2% boron/copper. An objective of the present invention is to
provide for methods and compositions of casting, fabricating and soldering
white gold that does not incorporate nickel or palladium. The present
invention also discloses no tarnish results when hydrogen is used as a
catalyst to all compositions.
