The invention is directed to a method to embed a thick film resistor
composition into a printed wiring board comprising the steps of applying a
reinforcing composition onto a resistor composition disposed on a metallic
substrate forming an assembly wherein the resistor composition is at least
partially coated with the reinforcing composition; processing the
assembly; and applying the assembly onto at least one side of an organic
substrate forming a component wherein the organic substrate is at least
partially coated with an adhesive layer and wherein the reinforcing
composition side of the assembly is embedded into the adhesive layer. The
reinforcing composition allows laser trimming of the fired resistor and
also eliminates cracking during lamination steps of the invention.
