A method and structure for a microelectronic device comprises a first film
over a substrate, a first polish resistant layer over the first film, a
second film over the first polish resistant layer, a second polish
resistant layer over the second film, wherein the first and second polish
resistant layers comprise diamond-like carbon. The first film comprises an
electrically resistive material, while the second film comprises low
resistance conductive material. The first film is an electrical resistor
embodied as a magnetic read sensor. The electrically resistive material is
sensitive to magnetic fields. The device further comprises a generally
vertical junction between the first and second films and a dielectric film
abutted to the electrically resistive material.
