Method of producing electronic parts, and member for production thereof

   
   

A base layer, which is supposed to be burnt off by baking, is formed on an unbaked member such as ceramic green sheet or laminated ceramic green sheets. This base layer improves ink acceptability of the unbaked ceramic member particularly for low viscosity ink such as jet-ink, and prevents oozing, draining, uneven thickness. This structure thus allows the inkjet to form a precise pattern. The base layer is burnt off at the baking step in the manufacturing process of electronic components, thus it does not adversely affect the reliability of the electronic component.

Una capa baja, que se supone ser quemada apagado cociendo al horno, se forma en un miembro crudo tal como hoja verde de cerámica u hojas verdes de cerámica laminadas. Esta capa baja mejora la aceptabilidad de la tinta del miembro de cerámica crudo particularmente para la tinta de la viscosidad baja tal como jet-tinta, y evita la exudación, drenando, grueso desigual. Esta estructura permite así que la inyección de tinta forme un patrón exacto. La capa baja se quema apagado en el paso de la hornada en el proceso de fabricación de componentes electrónicos, así no afecta al contrario la confiabilidad del componente electrónico.

 
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