A semiconductor device wherein a resin containing as a cross-linking
component a compound having a plurality of styrene group and represented
by chemical formula [1] is used as an insulating material:
##STR1##
where R is a hydrocarbon structure which may have a substituent group or
groups, R.sup.1 is hydrogen, methyl, or ethyl, m is and integer of 1 to 4,
and n is an integer of not less than 2. With this, a semiconductor device
and a semiconductor package which show excellent transmission
characteristics and less power consumption are provided.
