A semiconductor die carrier includes a radiation shielding base having a
radiation shielding integrated base flange extending orthogonally from an
upper surface of the base, the integrated base flange having an upper
surface. A substrate is disposed on the radiation shielding base and
around the integrated base flange, the substrate has an uppermost tier
with an upper surface that is not higher than the upper surface of said
integrated base flange. A radiation shielding seal lid has a radiation
shielding integrated seal lid flange, the radiation shielding integrated
seal lid flange has a lower surface disposed on the upper surface of the
uppermost tier of the substrate.
