Method and apparatus for thermally conditioning a microchip is described.
The microchip (104) is thermally conditioned responsive to a temperature
target over an interval of time. A diode voltage of a diode (503) of the
microchip (104) is measured from which diode temperature is determined.
The diode temperature is compared with the temperature target to determine
a temperature error. This thermal conditioning may be repeated, where
interval times are adjustable responsive to temperature error, until a
stabilization band (401) is reached. Because a diode (503) of the
microchip (104) is used, junction temperature, as opposed to external
surface temperature of the microchip package, is obtained. Accordingly, a
thermocouple attached to the external surface of the microchip is not
needed.
