Solders

   
   

A substantially lead-free solder with enhanced properties comprises from 88.5% to 93.5% tin; from 3.5% to 4.5% silver; from 2.0% to 6.0% indium; and from 0.3% to 1.0% copper. The solder may also comprise up to 0.5% of an anti-oxidant or anti-skinning additive. A solder embodying the invention finds particular utility in wave-soldering processes where it may be used as a direct replacement for conventional tin/lead solder.

Uma solda substancialmente lead-free com propriedades realçadas compreende a lata 88.5% a 93.5%; prata 3.5% a 4.5%; indium 2.0% a 6.0%; e cobre 0.3% a 1.0%. A solda pode também compreender até 0.5% de um aditivo anti-oxidant ou anti-skinning. Uma solda que embodying a invenção encontra a utilidade particular nos processos desolda onde pode ser usada como uma recolocação direta para a solda convencional de tin/lead.

 
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< Zirconium-base alloy and nuclear reactor component comprising the same

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> Silver-containing particles, method and apparatus of manufacture, silver-containing devices made therefrom

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