The temperature of a plasma chamber of a semiconductor fabrication tool is
maintained substantially constant utilizing a variety of techniques,
separately or in combination. One technique is to provide the exterior
surface of the plasma chamber dome with a plurality of fins projecting
into high velocity regions of an overlying airflow in order to dissipate
heat from the chamber. Ducting defined by cover overlying the exposed
exterior surface of the dome may also feature projecting lips or an
airfoil to place high velocity components of the airflow into contact
within the exterior dome surface and the fins. Other techniques include
employing a high speed fan to control airflow circulation, and the use of
temperature sensors in communication the fan through a processor to
control fan speed and thereby regulate chamber temperature.
