Integrated circuit cooling device

   
   

Various embodiments of a semiconductor-on-insulator substrate incorporating a Peltier effect heat transfer device and methods of fabricating the same are provided. In one aspect, a circuit device is provided that includes an insulating substrate, a semiconductor structure positioned on the insulating substrate and a Peltier effect heat transfer device coupled to the insulating substrate to transfer heat between the semiconductor structure and the insulating substrate.

 
Web www.patentalert.com

< Display device and process of producing the same

< Semiconductor device and method for fabricating the same

> High-frequency module device

> Microstructure array, mold for forming a microstructure array, and method of fabricating the same

~ 00136