Integrated circuit dielectric and method

   
   

A surface treatment for porous silica to enhance adhesion of overlying layers. Treatments include surface group substitution, pore collapse, and gap filling layer (520) which invades open surface pores (514) of xerogel (510).

Un trattamento di superficie affinchè silicone poroso aumentino adesione degli strati sovrastanti. I trattamenti includono la sostituzione di superficie del gruppo, il crollo del poro e lo strato riempientesi di spacco (520) che invadono i pori di superficie aperti (514) di xerogel (510).

 
Web www.patentalert.com

< Method of producing pattern-formed structure and photomask used in the same

< Film forming method by radiating a plasma on a surface of a low dielectric constant film

> Buffer layers on metal alloy substrates for superconducting tapes

> Materials for optical applications

~ 00136