Substrate independent superpolishing process and slurry

   
   

The present invention utilizes a combination of chemical and mechanical finishing processes to polish a disk substrate surface to near atomic smoothness. Broadly speaking, the surface of a disk substrate that has been machined (i.e., rough ground) to a predetermined surface roughness is subjected to attack by a chemical formulation (called an attacking agent). The chemical formulation is used to soften the substrate material. Then, the softened material is "wiped away" via mechanical action.

La actual invención utiliza una combinación de los procesos de acabamiento químicos y mecánicos para pulir una superficie del substrato del disco a la suavidad atómica cercana. Ampliamente hablando, la superficie de un substrato del disco que se ha trabajado a máquina (es decir, terreno desigual) a una aspereza superficial predeterminada es sujetada al ataque por una formulación química (llamada un agente que ataca). La formulación química se utiliza para ablandar el material del substrato. Entonces, el material ablandado "se limpia lejos" vía la acción mecánica.

 
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